High Gas Barrier Adhesives as Encapsulation for Flexible OLED

For the several decade years, organic light-emitting diodes (OLEDs) have been intensively studied because of their potential applicability to large-size flat panel displays, and more recently also solid-state lighting [1-4]. However, the lifetimes of the organic electronic devices are one of the most matters for the practical use of such devices, because of the ambient moisture and oxygen immediately ravage the organic semiconductors and low work function metal cathodes of the devices[5-8]. To solve this lifetime issue, a variety of encapsulation methods have been proposed. The conventional method for glass-based OLEDs (Figure 1.) has been to seal the OLED with a glass using ultraviolet curable resin such as epoxy resin based glue. A getter material such as calcium oxide (CaO) is often incorporated within the package to eliminate residual ambient moisture and oxygen and water penetrating through the epoxy resin from the edge.